本帖最后由 y_qiyong 于 2022-11-2 17:23 编辑 来自TI 73605 DCDC的布局建议： 1. Place ceramic high frequency bypass capacitors as close as possible to the PVIN and PGND pins, which are right next to each other on the package. Place the small value ceramic capacitor closest to the pins. This is very important for EMI performance.