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    1. 7th generation IGBT module for industrial application

      标签：IGBT module

      7th generation IGBT module for industrial application

      下载次数 3次 资源类型 学术论文 上传时间 2020-02-22

    2. High Efficiency Cooling Technology for High Power Density

      标签：High Power Density IGBT

      We applied a new aluminum direct liquid cooling technology to next-generation standard IGBT module for xEV applications. By applying new wave fin structure which can effectively dissipate the heat generated by power semiconductor devices, high cooling capability is achieved, and balanced flow speed distribution was successfully improved as well. Through visualization experiments, we confirmed that the development of the boundary layer was suppressed and the flow velocity on the fin surface increased. Similarity between the experimental flow pattern and its simulated counterpart was also verified. Our newly developed direct liquid cooling IGBT module with high performance wave fin realized 20% reduction in thermal impedance, compared with conventional ones.

      下载次数 0次 资源类型 学术论文 上传时间 2020-02-22

    3. Infineon-IFCM30U65GD-DS-v02_02-EN

      标签：IPM

      Control Integrated POwer System Dual In-Line Intelligent Power Module Three Phase Interleaved PFC 650V / 30A

      下载次数 1次 资源类型 应用文档 上传时间 2020-02-15

    4. IM818-MCC Datasheet

      标签：Infineon

      The CIPOS? Maxi IM818 product group offers the chance for integrating various power and control components to increase reliability, optimize PCB size and system costs. It is designed to control three phase AC motors and permanent magnet motors in variable speed drives applications such as low power motor drives (GPI, Servo drives), pumps, fan drives and active filter for HVAC(Heating, Ventilation, and Air Conditioning). The product concept is specially adapted to power applications, which need good thermal performance and electrical isolation as well as EMI save control and overload protection.

      下载次数 0次 资源类型 应用文档 上传时间 2020-02-15

    5. Die attach using silver sintering. Practical

      标签：Die attache ECU 汽车电子

      The vast majority of the power semiconductor dies are secured to a substrate using solder (see the structure of a classical power module in Figure 1). In most cases, a solder alloy with a high lead content is used (these alloys are refered to as High Melting Point, or HMP). Many studies are focused on replacing these alloys, for they are toxic, not reliable enough or because a higher operating temperature is requested. One of the most promising alternatives is based on silver sintering.

      下载次数 1次 资源类型 学术论文 上传时间 2020-02-15

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